The Bluetooth Bluetooth Special Interest Group (SIG) this week formally adopted Bluetooth Core Specification Version 3.0 + High Speed (HS), or Bluetooth 3.0. This latest iteration of the popular short-range wireless technology fulfills the consumers’ need for speed while providing the same wireless Bluetooth experience – faster. Manufacturers of consumer electronics and home entertainment devices can now build their products to send large amounts of video, music and photos between devices wirelessly at speeds consumers expect.
Bluetooth 3.0 gets its speed from the 802.11 radio protocol. The inclusion of the 802.11 Protocol Adaptation Layer (PAL) provides increased throughput of data transfers at the approximate rate of 24 Mbps. In addition, mobile devices including Bluetooth 3.0 + HS will realize increased power savings due to enhanced power control built in.
This newest version of Bluetooth technology builds on the inherent qualities of the current 2.1 + EDR version, including Simple Secure Pairing and built-in, automatic security. And as with all versions of the Bluetooth specification, v3.0 + HS provides developers, manufacturers and consumers with the benefit of backwards compatibility, enabling both the expansion and enhancement of this technology with every new specification release.
Applications
With the availability of Bluetooth version 3.0 + HS, consumers can expect to move large data files of videos, music and photos between their own devices and the trusted devices of others, without the need for cables and wires. Some applications consumers will experience include:
- Wirelessly bulk synchronize music libraries between PC and music player or phone
- Bulk download photos to a printer or PC
- Send video files from camera or phone to computer or television
Availability
The Bluetooth SIG’s formal adoption of the specification is only the first step in the product lifecycle. News out today from wireless chip manufacturers and Bluetooth SIG member companies Atheros, Broadcom and CSR shows the second step – getting silicon solutions to device manufacturers – is already underway. End products for consumers are expected to be in the market in 9 to 12 months.
Technical specs
This new specification release includes several major enhancements:
- Generic Alternate MAC/PHY (AMP)
- 802.11 Protocol Adaptation Layer (PAL)
- Generic Test Methodology
- Enhanced Power Control
- Unicast Connectionless Data
